Abstract: The through silicon via (TSV) arrays play the role of vertical electrical interconnections in the 3-D stacked integrated circuits. However, the coupling crosstalk between the adjacent TSVs ...

Abstract: To address the issue of low accuracy in 3D point cloud registration, we present a novel iterative closest point (ICP) algorithm for point registration using the stochastic differential ...

Starting in the new year, Canada’s grocery code of conduct will be in place, but the impact on your shopping experience remains to be seen. Does that mean prices will go down? One expert is cautioning ...

When using Multimodal metrics (e.g., MultimodalFaithfulnessMetric), the internal logic sometimes passes a single string prompt to the model's generate or a_generate method. In ...